View BU9795AFV_5356043.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

bu9795aks2 d product structure 9? silicon monolithic integrated circuit d this product is not designed prot ection against radioactive rays. 1/37 tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 14 :/ 001 datashee t standard lcd segment drivers bu9795axxx series max 140 segments (seg35com4) features ? integrated ram for display data (ddram) : 35 4bit (max 140 segment) ? lcd drive output : 4 common output, max 35segment output ? integrated buffer amp for lcd driving ? integrated oscillator circuit ? no external components ? low power consumption design applications ? telephone ? fax ? portable equipment (pos, ecr, pda etc.) ? dsc ? dvc ? car audio ? home electrical appliance ? meter equipment etc. h key specifications supply voltage range: +2.5v to +5.5v operating temperature range: -40c to +85c max segments: bu9795akv 140 segments BU9795AFV 108 segments bu9795aguw 124 segments bu9795aks2 140 segments display duty: 1/4 bias: 1/2, 1/3 selectable interface: 3wire serial interface h packages w (typ.) x d (typ.) x h (max.) h typical application circuit figure 1. typical application circuit controller vdd vlcd inhb csb sd scl oscin test vss com0 com1 com2 com3 seg0 seg1 se g ment lcd vdd seg34 ???? ??? using internal oscillator ssop-b40 13.60mm x 7.80mm x 2.00mm v qfp48c 9.00mm x 9.00mm x 1.60mm v bga048w040 4.00mm x 4.00mm x 0.90mm sqfp-t52m 12.00mm x 12.00mm x 1.40mm
2/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 block diagrams / pin confi gurations / pin descriptions bu9795akv figure 2. block diagram figure 3. pin configuration (top view) table 1 pin description pin name pin no. i/o function inhb 48 i input terminal for turn off display h : turn on display l : turn off display test 47 i test input (rohm use only) must be connect to vss oscin 43 i external clock input external clock and internal clock can be selected by command. must be connect to vss when use internal oscillation circuit. sd 46 i serial data input scl 45 i serial data transfer clock csb 44 i chip select : ?l? active vss 42 gnd vdd 41 power supply vlcd 40 power supply for lcd driving seg0 to 34 1 to 35 o segment output for lcd driving com0 to 3 36 to 39 o common output for lcd driving lcd bias selector common driver segment driver oscillator power on reset sd scl vlcd oscin vss com0 com3 seg0 seg34 if filter serial inter face command register common counter ddram lcd voltage generator command data decoder blink timing generator vdd csb test inhb com0 seg34 seg33 seg32 seg31 seg30 seg29 seg28 seg27 seg26 seg25 seg24 com1 seg23 com2 seg22 com3 seg21 vlcd seg20 vdd seg19 vss seg18 oscin seg17 csb seg16 scl seg15 sd seg14 test seg13 inhb seg12 36 25 1 2 1 37 48 24 13 seg0 seg1 seg2 seg3 seg4 seg5 seg6 seg7 seg8 seg9 seg10 seg11 1
3/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h block diagrams / pin configurati ons / pin descriptions - continued BU9795AFV figure 4. block diagram figure 5. pin configuration (top view) table 2 pin description pin name pin no. i/o function inhb 36 i input terminal for turn off display h : turn on display l : turn off display test 35 i test input (rohm use only) must be connect to vss oscin 31 i external clock input ex clock and int clock can be changed by command. must be connect to vss when use internal oscillation circuit. sd 34 i serial data input scl 33 i serial data transfer clock csb 32 i chip select : ?l? active vss 30 gnd vdd 29 power supply vlcd 28 i power supply for lcd driving seg4 to 30 1 to 23, 37 to 40 o segment output for lcd driving com0 to 3 24 to 27 o common output for lcd driving lcd bias selector common driver segment driver oscillator power on reset sd scl vlcd oscin vss com0 com3 seg0 seg30 if filter serial inter face command register common counter ddram lcd voltage generator command data decoder blink timing generator vdd csb test inhb seg22 seg21 seg17 seg20 seg16 seg23 seg19 seg10 seg8 seg9 seg11 seg12 seg13 seg14 seg15 seg18 seg26 seg25 seg24 seg27 scl sda seg5 test seg6 csb inhb seg30 seg28 seg29 com0 com2 com3 seg7 seg4 vdd vss oscin vlcd com1
4/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h block diagrams / pin configurati ons / pin descriptions - continued bu9795aguw figure 6. block diagram figure 7. pin configuration (bottom view) table 3 pin description pin name i/o function inhb i input terminal for turn off display h : turn on display l : turn off display test i test input (rohm use only) must be connect to vss oscin i external clock input ex clock and int clock can be changed by command. must be connect to vss when use internal oscillation circuit. sd i serial data input scl i serial data transfer clock csb i chip select : ?l? active vss gnd vdd power supply vlcd i power supply for lcd driving seg2 to 32 o segment output for lcd driving com0 to 3 o common output for lcd driving lcd bias selector common driver segment driver oscillator power on reset sd scl vlcd oscin vss com0 com3 seg0 seg32 if filter serial inter face command register common counter ddram lcd voltage generator command data decoder blink timing generator vdd csb test inhb 1234567 g (nc) seg13 seg15 seg18 seg20 seg22 (nc) f seg11 seg12 seg16 seg17 seg21 seg23 seg24 e seg9 seg10 seg14 seg19 seg25 seg27 seg26 d seg7 seg6 seg8 seg5 seg30 seg28 seg29 c seg4 seg3 seg2 csb com3 seg32 seg31 b inhb sd vss vdd com1 com0 a (nc) test2 scl oscin vlcd com2 (nc)
5/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h block diagrams / pin configurations / pin descriptions ? continued bu9795aks2 seg23 seg22 nc seg21 seg20 seg19 seg18 seg17 seg16 seg15 nc seg14 seg13 seg24 seg12 seg25 seg11 seg26 seg10 seg27 seg9 seg28 seg8 seg29 seg7 seg30 seg6 seg31 seg5 seg32 seg4 seg33 seg3 seg34 seg2 com0 seg1 com1 seg0 com2 com3 nc vlcd vdd vss osci n csb scl sda nc test inhb 1 13 14 26 27 39 40 52 figure 8. i`6"? figure 9. %562)'?? (top view) table 1 %56.?? %56, %56!? i/o ?(? inhb 13 i input terminal for turn off display h : turn on display l : turn off display test 12 i test input (rohm use only) must be connect to vss oscin 7 i external clock input ex clock and int clock can be changed by command. must be connect to vss when use internal oscillation circuit. sd 10 i serial data input scl 9 i serial data transfer clock csb 8 i chip select : ?l? active vss 6 gnd vdd 5 power supply vlcd 4 power supply for lcd driving seg0-34 14-28, 30-36 38-50 o segment output for lcd driving com0-3 51-52, 1-2 o common output for lcd driving lcd bias selector common driver segment driver oscillator power on reset sd scl vlcd oscin vss com0 com3 seg0 seg34 if filter serial inter face command register common counter ddram lcd voltage generator command data decoder blink timing generator vdd csb test inhb
6/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h absolute maximum ratings (vss=0v) parameter symbol ratings unit remark power supply voltage1 vdd -0.5 to +7.0 v power supply power supply voltage2 vlcd -0.5 to vdd v lcd drive voltage allowable loss pd 0.6 w when use more than ta=25 ` , subtract 6mw per degree.(bu9795akv) (package only) 0.7 w when use more than ta=25 ` , subtract 7mw per degree (BU9795AFV) (package only) 0.27 w when use more than ta=25 c, subtract 2.7mw per degree (bu9795aguw) (package only) 0.85 w when use more than ta=25 c, subtract 8.5mw per degree (bu9795aks2) (package only) input voltage range vin -0.5 to vdd+0.5 v operational temperature range topr -40 to +85 ` storage temperature range tstg -55 to +125 ` recommended operating ratings(ta=-40c to +85c,vss=0v) parameter symbol ratings unit remark min. typ. max. power supply voltage1 vdd 2.5 - 5.5 v power supply power supply voltage2 vlcd 0 - vdd -2.4 v lcd drive voltage * please use vdd-vlcd 2.4v condition. electrical characteristics dc characteristics (vdd=2.5v to 5.5v, vss=0v, ta =-40c to +85c, unless otherwise specified) parameter symbol limits unit conditions min typ max ?h? level input voltage vih 0.7vdd - vdd v ?l? level input voltage vil vss - 0.3vdd v ?h? level input current iih - - 1 a ?l? level input current iil -1 - - a lcd driver on resistance seg ron - 3.5 - k ? iload=10a com ron - 3.5 - k ? vlcd supply voltage vlcd 0 - vdd -2.4 v vdd-vlcd 2.5v standby current ist - - 5 a display off, oscillator off power consumption 1 idd1 - 12.5 30 a vdd=3.3v, ta=25c, power save mode1, fr=70hz 1/3 bias, frame inverse power consumption 2 idd2 - 20 40 a vdd=3.3v, ta=25c, normal mode, fr=80hz 1/3 bias, line inverse
7/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h electrical characteristics - continued oscillation characteristics (vdd=2.5v to 5.5v,vss=0v, ta=-40c to +85c) parameter symbol limits unit conditions min typ max frame frequency f clk 56 80 104 hz fr = 80hz setting frame frequency1 f clk1 70 80 90 hz vdd=3.5v, 25 c mpu interface characteristics(vdd=2.5v to 5.5v,vss=0v, ta=-40c to +85c) parameter symbol limits unit conditions min typ max input rise time tr - - 80 ns input fall time tf - - 80 ns scl cycle time tscyc 400 - - ns ?h? scl pulse width tshw 100 - - ns ?l? scl pulse width tslw 100 - - ns sd setup time tsds 20 - - ns sd hold time tsdh 50 - - ns csb setup time tcss 50 - - ns csb hold time tcsh 50 - - ns ?h? csb pulse width tchw 50 - - ns figure 10. interface timing h i/o equivalent circuit figure 11. i/o equivalent circuit csb scl sd tcsh tscyc tslw tshw tsds tsdh tf tr tcss tchw vdd vlcd vss vdd inhb vss vdd test vss vdd oscin vss vdd vss vdd csb, sd, scl vss
8/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h example of recommended circuit using internal oscillator using external oscillator figure 12. bu979 5akv/bu9795aks2 e.g. of recommended circuit controller vdd vlcd inhb csb sd scl oscin test vss com0 com1 com2 com3 seg0 seg1 segment lcd vdd seg34 ??? ??? controlle r vdd vlcd inhb csb sd scl oscin test vss com0 com1 com2 com3 seg0 seg1 se g ment lcd vdd seg34 ???? ???
9/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h example of recommended circuit - continued <BU9795AFV> using internal oscillator using external oscillator figure 13. BU9795AFV e.g. of recommended circuit controller vdd vlcd inhb csb sd scl oscin test vss com0 com1 com2 com3 seg4 seg5 se g ment lcd vdd seg30 ? ? ? ? ? ? controller vdd vlcd inhb csb sd scl oscin test vss com0 com1 com2 com3 seg4 seg5 segment lcd vdd seg30 ? ? ? ? ? ?
10/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h example of recommended circuit- continued using internal oscillator using external oscillator figure14. bu9795aguw e.g. of recommended circuit controller vdd vlcd inhb csb sd scl oscin test vss com0 com1 com2 com3 seg seg se g ment lcd vdd seg32 ? ? ? ? ? ? ? ? ? ? ? ? controller vdd vlcd inhb csb sd scl oscin test vss com0 com1 com2 com3 seg2 seg3 segment lcd vdd seg32 ? ? ? ? ? ? ? ? ? ? ? ?
11/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h function description d command and data transfer method d 3-spi (3wire serial interface) this device is controlled by 3-wire signal (csb, scl, and sd). first, interface counter is initialized with cs b=?h", and csb=?l? makes sd and scl input enable. the protocol of 3-spi transfer is as follows. each command starts with command or data judgment bit (d/c) as msb data, and continuously in order of d6 to d0 are followed after csb =?l?. (internal data is latched at the rising e dge of scl, it converted to 8bits para llel data at the falling edge of 8th clk.) d/c = ?h? : command d/c = ?l? : data figure 15. 3-spi command/data transfer format d command transfer method after csb=?h? ?l?, 1st byte is always a command input. msb of the command input data will be ju dged that the next byte data is a command or display data (this bit calls ?command or data judgment bit?). when set ?command or data judge bit?=?1?, next byte will be (continuously) command. when set ?command or data judge bit?=?0?, next byte data is display data. once it becomes display data transfer condition, it will no t be back to command input condition even if d/c=1. so if you want to send command data again, please set csb=?l? ?h?. (csb ?l? ?h? will cancel data transfer condition.) command transfer is done by 8bits unit, so if csb=?l? ?h? with less than 8bits data transfer, command will be cancelled. it will be able to transfer command with csb=?l? again. figure 16. command transfer format 1 command 1 command 1 command 0 command ? display data command command/data d5 scl csb sd d2 d1 d0 d7 d/c d6 d5 d4 d3 d2 d1 d0 d/c d1 d0 d7 d6 d6 d5 d4 d3 d6 d5 d4 d3 d2 command command disctl command transfer command cancelled (less than 8bits) dispon command transfe r in case of command transfe r sd 1234567 6 12345 1 status 8 78 67 csb scl 8 12345
12/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 d write display data and transfer method this lsi has display data ram (ddram) of 354=140bit. the relationship between data input and display data, ddram data and address are as follows. 8 bit data will be stored in ddram. the address to be wri tten is the address specified by adset command, and the address is automatically incr emented in every 4bit data. data can be continuously written in ddram by transmitting data continuously. (when ram data is written successively after writing ra m data to 22h (seg34), the address is returned to 00h (seg0) by the auto-increment function. ddram address 00h 01h 02h 03h 04h 05h 06h 07h n n n n n n n 1eh 1fh 20h 21h 22h bit 0 a e i m q u com0 1 b f j n r v com1 2 c g k o s x com2 3 d h l p t y com3 seg 0 seg 1 seg 2 seg 3 seg 4 seg 5 seg 6 seg 7 n n n n n n n seg 30 seg 31 seg 32 seg 33 seg 34 as data transfer to ddram happens every 4bit data, it will be cancelled if it changes csb=?l? ?h? before 4bits data transfer. figure 17. bu9795akv/bu9795aks2 data transfer format 0000000 a b c d e f g h i j k l m n o p ? display data command d3 d2 d1 return to address "0" by automatically increment. a ddress00h ram write d4 d6 internal signal d5 ram write d0 d6 d5 d0 d7 d6 write data will be canceled, when csb='h' without 4bit data transfer. d4 d3 d2 d1 d0 internal signal ram write a ddress00h a ddress01h command csb scl d7 sd a ddress se t scl csb sd d2 a ddress se t d3 d7 command ram write d1 d6 d5 d4 d0 d7 a ddress02h a ddress00h a ddress21h a ddress22h ram write (every 4bit data) d5 d4 d3 d2 d1
13/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 <BU9795AFV> this lsi has display data ram (ddram) of 274=108bit. as seg0, seg1, seg2, seg3, seg31, seg32, seg33, seg34 are not output, these address will be dummy address. the relationship between data input and display data, ddram data and address are as follows. 0000000 a b c d e f g h i j k l m n o p q r s t u v x y display data command dummy data 8 bit data will be stored in ddram. the address to be wr itten is the address specified by adset command, and the address is automatically incr emented in every 4bit data. data can be continuously written in ddram by transmitting data continuously. (when ram data is written successively after writing ram data to 22h (seg34), the address is returned to 00h (seg0) by the auto-increment function. ddram address 00h 01h 02h 03h 04h 05h 06h 07h n n n n n n n 1eh 1fh 20h 21h 22h bit 0 a e i m q u com0 1 b f j n r v com1 2 c g k o s x com2 3 d h l p t y com3 seg 0 seg 1 seg 2 seg 3 seg 4 seg 5 seg 6 seg 7 n n n n n n n seg 30 seg 31 seg 32 seg 33 seg 34 as data transfer to ddram happens every 4bit data, it will be cancelled if it changes csb=?l? ?h? before 4bits data transfer. figure 18. BU9795AFV data transfer format dummy data dummy data d3 d2 d1 return to address "0" by automatically increment. a ddress00h ram write d4 d6 internal signal d5 ram write d0 d6 d5 d0 d7 d6 write data will be canceled, when csb='h' without 4bit data transfer. d4 d3 d2 d1 d0 internal signal ram write a ddress00h a ddress01h command csb scl d7 sd a ddress se t scl csb sd d2 a ddress se t d3 d7 command ram write d1 d6 d5 d4 d0 d7 a ddress02h a ddress00h a ddress21h a ddress22h ram write (every 4bit data) d5 d4 d3 d2 d1
14/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 this lsi has display data ram (ddram) of 314=124bit. as seg0, seg1, seg33, seg34 are not output, these address will be dummy address. the relationship between data input and display data, ddram data and address are as follows. 0000000 a b c d e f g h i j k l m n o p q r s t u v x y display data command dummy data 8 bit data will be stored in ddram. the address to be wr itten is the address specified by adset command, and the address is automatically incr emented in every 4bit data. data can be continuously written in ddram by transmitting data continuously. (when ram data is written successively after writing ram data to 22h (seg34), the address is returned to 00h (seg0) by the auto-increment function. ddram address 00h 01h 02h 03h 04h 05h 06h 07h n n n n n n n 1eh 1fh 20h 21h 22h bit 0 a e i m q u com0 1 b f j n r v com1 2 c g k o s x com2 3 d h l p t y com3 seg 0 seg 1 seg 2 seg 3 seg 4 seg 5 seg 6 seg 7 n n n n n n n seg 30 seg 31 seg 32 seg 33 seg 34 as data transfer to ddram happens every 4bit data, it will be cancelled if it changes csb=?l? ?h? before 4bits data transfer. figure 19. bu9795aguw data transfer format dummy data dummy data d3 d2 d1 return to address "0" by automatically increment. a ddress00h ram write d4 d6 internal signal d5 ram write d0 d6 d5 d0 d7 d6 write data will be canceled, when csb='h' without 4bit data transfer. d4 d3 d2 d1 d0 internal signal ram write a ddress00h a ddress01h command csb scl d7 sd a ddress se t scl csb sd d2 a ddress se t d3 d7 command ram write d1 d6 d5 d4 d0 d7 a ddress02h a ddress00h a ddress21h a ddress22h ram write (every 4bit data) d5 d4 d3 d2 d1
15/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 d oscillator several kinds of clock for logic and analog circuit are gener ated from internal oscillation circuit or external clock. this device has internal oscillator circuit. when you use internal oscillation circuit, please connect oscin to vss. *when you use external clock, execute icset co mmand and connect oscin to external clock. figure 20. using internal o scillator circuit figur e 21. using external clock d lcd driver bias circuit this lsi generates lcd driving voltage with on-chip buffer amp. and it can drive lcd at low power consumption. *1/3 and 1/2bias can be set in modeset command. *line and frame inversion can be set in disctl command. refer to ?lcd driving waveform? about each lcd driving waveform. d blink timing generator this device has blinking function. *this lsi is able to set blink mode with blkctl command. blink frequency varies widely by characteristic of fclk, when internal oscillation circuit. about the characteristics of fclk, re fer to oscillation characteristics. d reset (initial) condition initial condition afte r execute software reset is as follows. n display is off. n ddram address is initialized (ddram data is not initialized). refer to command description about initialize value of register. h command / function list description list of command / function no. command function 1 mode set (modeset) set lcd drive mode 2 address set (adset) set lcd display mode 1 3 display control (disctl) set lcd display mode 2 4 set ic operation (icset) set ic operation 5 blink control (blkctl) set blink mode 6 all pixel control (apctl) set pixel condition oscin bu9795akv /fv/guw/ks2 vss oscin bu9795akv /fv/guw/ks2 vss clock input
16/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h detailed command description d7 (msb) is bit for command or data judgment. refer to command and data transfer method. c : 0 : next byte is ram write data. c : 1 : next byte is command. d mode set (mode set) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 1 0 * p3 p2 * * (* : don?t care) set display on and off setting p3 reset initialize condition display off(dispoff) 0 d display on(dispon) 1 display off : regardless of ddram data, all segment and common output will be stopped after 1 frame off data write. display off mode will be finished by display on. display on : segment and common output will be active and start to read the display data from ddram. (note) it is not synchronize with display frame, when it will be controlled display on/off with inhb terminal. set bias level setting p2 reset initialize condition 1/3 bias 0 d 1/2 bias 1 refer to lcd driving waveform. d address set (adset) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 0 0 p4 p3 p2 p1 p0 address data is specified in p[4 : 0] and p2 (icset command) as follows. msb lsb internal register address [5] address [4] nnn address [0] bit of each command icset [p2] adset [p4] nnn adset [p0] the address is 00h in reset condition. the valid address is 00h to 22h. another address is invalid, (otherwise address will be set to 00h.) p2 of icset command is only to define either msb of address is ?1? or ?0?. address counter will be set only when adset command is executed.
17/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 figure 22. address set sequence csb command ??? internal signal icset p2 internal signal address set address by adset command. p2(icset command) is refer to set address. because of no setting adset command, a ddress will be set "000010", because p2(icset)="0". it will be kept the previous address. it will be start to write ram data from maintained address. when ram data is continuously transmitted, address will be increment automatically. when write at 22h address, address will be the followi ng address that write at the end is maintained. return to 00h automatically. csb command ??? internal signal icset p2 internal signal address set address by adset command. p2(icset command) is refer to set addre ss. new address will be set by adset command. a ddress will be set "011111", because p2(icset)="0". when ram data is continuously transmitted,the following address that write at the end is maintained. address will be increment automatically. when write at 22h address, address will be return to 00h automatically. csb command ??? internal signal icset p2 internal signal address set address by adset command. p2(icset command) is refer to set address. new address will be set by adset command. a ddress will be set "100000", because p2(icset)="1". a ddress will be set "100000", because p2(icset)="1". (p2(icset) will maintain the previous address until icset command input. it will be set p2="1" by icset command. when ram data is continuously transmitted, (icset command cannot set address) address will be increment automatically. the following address that write at the end is maintained. when write at 22h address, address will be return to 00h automatically. csb command ??? internal signal icset p2 internal signal address set address by adset command. it is written to ram continuously p2(icset command) is refer to set address. from the previous address. the address maintain the previous address when ram data is continuously transmitted, because it doesn't input the adset command address will be increment automatica lly. though icset p2="0" setting. when write at 22h address, address will be return to 00h automatically. the following address that write at the end is maintained. 000101 ram write ram write ????? ram write 000011 000100 disctl ram write 100010 000000 000001 000010 a dset?00010? ram write ram write 000011 000100 ram write a dset ?11111? ram write ram write ram write ????? 000010 ram write 100000 100001 100010 000000 icset p2=1 a dset ?00000? ram write ram write 000010 000011 ????? ram write 000001 100010 000000 100000 100001 000001 000010 000011 100000 100001 100010 000000 icset p2=1 a dset ?00000? ram write ram write ????? ram write icset p2=0 ram write ram write 100000 100001 100010 000000 100010 100000 100001 a dset?00000? ram write 000011 000001 ram write 000000 011111 ram write adset?00000? 000010 ??? ram write ram write ram write ram write 000000 000001 ?????
18/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 d display control (disctl) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 0 1 p4 p3 p2 p1 p0 set frame frequency setting p4 p3 reset initialize condition 80hz 0 0 d 71hz 0 1 64hz 1 0 53hz 1 1 * about the characteristics of fr, refer to oscillation characteristics. set lcd drive waveform setting p2 reset initialize condition line inversion 0 d frame inversion 1 set power save mode setting p1 p0 reset initialize condition power save mode 1 0 0 power save mode 2 0 1 normal mode 1 0 d high power mode 1 1 *vdd-vlcd 3.0v is required for high power mode. (reference current consumption data) setting reset initialize condition power save mode 1 0.5 power save mode 2 0.67 normal mode 1.0 high power mode 1.8 *above current consumption data is reference value. it depends on panel load. (note) frame rate fr / lcd drive waveform / power save mode sr will effect display image. select the best value in point of current consumption and display image using lcd panel (under real application). mode screen flicker display image / contrast frame frequency d - lcd drive waveform d d power save mode - d
19/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 d set ic operation (icset) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 1 1 0 1 p2 p1 p0 p2 : msb data of ddram address. please refer to ?adset? command. setting p2 reset initialize condition address msb?0? 0 d address msb?1? 1 set software reset condition setting p1 no operation 0 software reset 1 when ?software reset? is executed, this lsi will be reset to initial condition. if software reset is executed, the value of p2 and p1 will be ignored and they will be set initialized condition. (refer to ?reset initial condition?) switch between internal clock and external clock. setting p0 reset initialize condition internal clock 0 d external clock input 1 for internal clock : oscin is connected to vss. for external clock input : input external clock into oscin. disctl 80hz select : frame frequency [hz] = external clock[hz] / 512 disctl 71hz select : frame frequency [hz] = external clock[hz] / 576 disctl 64hz select : frame frequency [hz] = external clock[hz] / 648 disctl 53hz select : frame frequency [hz] = external clock[hz] / 768 command icset oscin_en (internal signal) internal clock mode external clock mode (internal signal) external clock (oscin) internal oscillation figure 23. oscmode switching timing
20/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 d blink control (blkctl) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 1 1 1 0 * p1 p0 set blink condition setting (hz) p1 p0 reset initialize condition off 0 0 d 0.5 0 1 1 1 0 2 1 1 d all pixel control (apctl) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 1 1 1 1 1 p1 p0 all display set on. off setting p1 reset initialize condition normal 0 d all pixel on 1 setting p0 reset initialize condition normal 0 d all pixel off 1 all pixels on : all pixels are on regardless of ddram data. all pixels off : all pixels are off regardless of ddram data. (note) all pixels on/off is effective only at the time of ?display on? status. the data of ddram do not change with this command. if both p1 and p0=?1?, apoff is selected. apoff has higher priority than apon.
21/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h lcd driving waveform (1/3bias) line inversion frame inversion figure 24. line inversion waveform(1/3bias) figure 25. frame inversion waveform(1/3bias) 1frame com0 com1 com2 com3 segn segn+1 segn+2 segn+3 statea (com0-segn) stateb (com1-segn) seg n+2 seg n+3 com3 statea segn seg n+1 com0 com1 com2 stateb vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd 1frame com0 com1 com2 com3 segn segn+1 segn+2 segn+3 statea (com0-segn) stateb (com1-segn) com2 com3 com0 statea com1 stateb segn seg n+1 seg n+2 seg n+3 vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd
22/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 (1/2bias) line inversion frame inversion figure 26. line inversion waveform(1/2bias) figure 27. frame inversion waveform(1/2bias) 1frame statea (com0-segn) stateb (com1-segn) com2 com3 com0 statea com1 stateb segn seg n+1 seg n+2 seg n+3 segn segn+1 segn+2 segn+3 com0 com1 com2 com3 vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd 1frame statea (com0-segn) stateb (com1-segn) com1 stateb com2 com3 seg n+2 seg n+3 com0 statea segn seg n+1 segn segn+1 segn+2 segn+3 com0 com1 com2 com3 vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd
23/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h example of display data if lcd layout pattern is shown as in figure ,figure and dd ram data is shown as in table1, display pattern will be shown as in figure . com1 com2 com3 com0 figure 28. e.g. com line pattern figure 29. e.g. seg line pattern figure 30. e.g. display pattern table ddram data map s e g 0 s e g 1 s e g 2 s e g 3 s e g 4 s e g 5 s e g 6 s e g 7 s e g 8 s e g 9 s e g 10 s e g 11 s e g 12 s e g 13 s e g 14 s e g 15 s e g 16 s e g 17 s e g 18 s e g 19 com0 d0 0 1 10 1 1 110100000 0 0 0 00 com1 d1 0 0 11 1 0 011110000 0 0 0 00 com2 d2 0 0 01 0 1 001010000 0 0 0 00 com3 d3 0 0 11 0 0 010100000 0 0 0 00 address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0ah 0bh 0ch 0dh 0eh 0fh 10h 11h 12h 13h seg1 seg2 seg3 seg4 seg5 seg6 seg7 seg8 seg9 seg10
24/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h initialize sequence please follow sequence below after power-on to set this device to initial condition. power on csb ?h? ?i/f initialize condition csb ?l? ?i/f data transfer start execute software reset by sending icset command * each register value and ddram address, ddram data are random condition after power on till initialize sequence is executed. h start sequence d start sequence example1 no. input d7 d6 d5 d4 d3 d2 d1 d0 descriptions 1 power on vdd=0 to 5v (tr=0.1ms) 2 wait 100us initialize ic 3 csb ?h? initialize i/f data 4 csb ?l? i/f data transfer start 5 icset 1 1 1 0 1 * 1 0 software reset 6 blkctl 1 1 1 1 0 * 0 1 7 disctl 1 0 100110 8 icset 1 1 101000 ram address msb set 9 adset 0 0 000000 ram address set 10 display data * * * * * * * * address 00h to 01h display data * * * * * * * * address 02h to 03h ? ? display data * * * * * * * * address 22h to 00h 11 csb ?h? i/f data transfer stop 12 csb ?l? i/f data transfer start 13 modeset 1 1 0 * 1 0 * * display on 14 csb ?h? i/f data transfer stop
25/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 d start sequence example2 initialize sequence dispon sequence ram write sequence dispoff sequence this lsi is initialized with initialize sequenc e. and start to display with dispon sequence. this lsi will update display data with ram write sequence. a nd stop the display with dispoff sequence. if you want to restart to display, this lsi will restart to display with dispon sequence. initialize sequence d7 d6 d5 d4 d3 d2 d1 d0 ic initialized i/f initialized icset 11101010 software reset modeset 11000000 display off a dset 00000000 ram address set display data * * ** * * * * display data dispon sequence d7 d6 d5 d4 d3 d2 d1 d0 disctl 10111111 display control blkctl 11110000 blkctl a pctl 11111100 a pctl modeset 11001000 display on ram write sequence d7 d6 d5 d4 d3 d2 d1 d0 disctl 10111111 display control blkctl 11110000 blkctl a pctl 11111100 a pctl modeset 11001000 display on a dset 00000000 ram address set display data * * ** * * * * display data dispoff sequence d7 d6 d5 d4 d3 d2 d1 d0 modeset 11000000 display off csb 'h' input data description csb 'l' description csb 'l' ? csb 'h' csb 'l' csb 'h' input data csb 'h' input data description wait 100us csb 'h' csb 'l' ? input data description power on initialize ram write dispoff dispon
26/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h example of start sequence start please select frame rate from 80hz,71hz,64hz,53hz according to lcd panel characteristic. line inversion. power save mode= high power mode operating current display qualit y reduce operating current or enhance display quality disctl setup value "101**011" operating current decreases in order o f 80hz>71hz>64hz>53hz. frame inversion. power save mode= power save mode1 disctl setup value "101**100" screen flicker? o k ng disctl setup value "101**101" disctl setup value "101**100" screen flicker? o k ng disctl setup value "101**101" disctl setup value "101**110" screen flicker? o k ng disctl setup value "101**110" disctl setup value "101**111" please select frame rate from 80hz,71hz,64hz,53hz according to lcd panel characteristic. frame inversion. power save mode= power save mode1 operating current decreases in order o f 80hz>71hz>64hz>53hz. frame inversion. power save mode= power save mode2 please select frame rate from 80hz,71hz,64hz,53hz according to lcd panel characteristic. frame inversion. power save mode= power save mode2 operating current decreases in order o f 80hz>71hz>64hz>53hz. frame inversion. power save mode= normal mode please select frame rate from 80hz,71hz,64hz,53hz according to lcd panel characteristic. frame inversion. power save mode= normal mode operating current decreases in order o f 80hz>71hz>64hz>53hz. frame inversion. power save mode= high power mode
27/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h cautions of power-on condition this lsi has ?p.o.r? (power-on reset) circuit and software reset function. please keep the following recommended power-on conditions in order to power up properly. please set power up conditions to meet the recommended tr, tf, toff, and vbot spec below in order to ensure p.o.r operation. recommended condition of tr,tf,toff,vbot figure 31. power on-off waveform if it is difficult to meet above conditions, ex ecute the following sequence after power-on. because it doesn?t accept the command in power off, it is nece ssary to care that correspondence by software reset doesn?t become alternative to por function completely. (1) csb=?l? ?h? condition vdd csb figure 32. csb timing (2) after csb?h? ?l?, execute software reset (icset command). tr tf toff vbot less than 1ms less than 1ms more than 150ms less than 0.1v vdd tf tr toff vbot
28/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h cautions on application in case, bu9795akv/bu 9795afv/bu9795aguw/bu9795aks2 used at vlcd vss, voltage gap occur between seg line to com1?3 line at display off state. because of this vo ltage gap, there is possibility to display lcd for a moment. to avoid this phenomenon, please decide vdd and vlcd level to satisfy voff voltage lower than off level (off level = 1v at the example explained below). condition vdd=5.0v vlcd=2.0v 1/3bias ddram data all "h" frame inversion vdd (5v) vlcd (2v) vlcd-vss=2v vss vdd (5v) vlcd (2v) vlcd-vss=2v vss vdd (5v) vlcd (2v) vlcd-vss=2v vss 3v 2v 1v 0v -1v -2v -3v 3v 2v 1v 0v -1v -2v -3v 1frame com0 output com1 output seg0 output voltage gap of com0-seg0 display on display off voltage gap of com1-seg0 display on display off send "display off" command the volatage between com0 to seg0 is 0v at display off. voltage gap occur between com1 to seg0 at display off. so, there is possibility to display lcd. only at com 1-3 line output vss level at display off (at com 1-3 terminal) output vlcd level at display off all seg terminal in case, vlcd voltage different from vss levelvlcdvss) in this case, volatage gap occur, between seg line to com 1-3 l ine. because of this gap, there is possibility to dis play lcd for a moment. voff on level off level output vlcd level at display off only com0 terminal the volatage between com1 to seg0 is -2v at display off.
29/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breakin g mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteristi cs can be provided approximately as expected. the electrical characteristics are guarantee d under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can br eak down ics. take protective measures against the breakdown due to the reverse connection, such as mounti ng an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and t he gnd lines. in this regard, or the digital block power supply and the analog block po wer supply, even though these power supplies has the same level of potential, separate the power supply pattern for the di gital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capa city dropout at a low temper ature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient. (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of t he ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or t he gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connec ted to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and t hen dismount it from the jig. in addition, for protection against static electricity, es tablish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set pcb. (9) input terminals in terms of the construction of ic, para sitic elements are inevitably formed in re lation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunct ion and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applie d to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a volt age lower than the power supply voltag e or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluc tuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well.
30/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h operational notes - continued (11) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant wi th consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. (12) no connecting input terminals in terms of extremely high impedance of cmos gate, to open the input terminals causes unstable state. and unstable state brings the inside gate voltage of p-channel or n-channel transistor into active. as a result, battery current may increase. and unstable state can also causes unexpected operat ion of ic. so unless otherwise specified, input terminals not being used should be connected to the power supply or gnd line. (13) rush current when power is first supplied to the cmos ic, it is possible t hat the internal logic may be unstable and rush current may flow instantaneously. therefore, give special condition to pow er coupling capacitance, power wiring, width of gnd wiring, and routing of connections. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
31/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 ordering information b u 9 7 9 5 a x x x - x x part number package packaging and forming specification e2: embossed tape and reel (vqfp48c/ ssop-b40/ vbga048w040/ sqfp-t52m) kv fv guw ks2 : vqfp48c : ssop-b40 : vbga048w040 : sqfp-t52m lineup segment output common output package orderable part number 35 4 vqfp48c reel of 1500 bu9795akv-e2 27 ssop-b40 reel of 2000 BU9795AFV-e2 31 vbga048w040 reel of 2500 bu9795aguw-e2 35 sqfp-t52m reel of 1000 bu9795aks2-e2 tray of 1000 bu9795aks2
32/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h physical dimension tape and reel information package name vqfp48c direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 1500pcs e2 () 1pin 1pin mark
33/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h physical dimension, tape and reel information ? continued package name ssop-b40 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin (max 13.95 (include. burr)
34/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h physical dimension, tape and reel information ? continued package name vbga048w040 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
35/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 h physical dimension, tape and reel information ? continued package name sqfp-t52m ? order quantity needs to be multiple of the minimum quantity. tray (with dry pack) container quantity direction of feed 1000pcs direction of product is fixed in a tray 1pin direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 1000pcs e2 () 1pin
36/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 marking diagrams part number package part number marking bu9795akv vqfp48c bu9795a BU9795AFV ssop-b40 BU9795AFV bu9795aguw vbga048w040 9795a bu9795aks2 sqfp-t 52m bu9795aks2 vqfp48c (top view) bu9795a part number marking lot number 1pin mark ssop-b40 (top view) BU9795AFV part number marking lot numbe r 1pin mark vbga048w040 (top view) 9795a part number marking lot number 1pin mark sqfp-t52m (top view) bu9795aks2 part number marking lot number 1pin mark
37/37 bu9795axxx series max 140 segments (seg35com4) datasheet tsz02201-0a0a2d300020-1-2 12.july.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 :/ 15 :/ 001 revision history date revision changes 1.jun.2012 001 new release 12.july.2012 002 add bu9795aks2
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

▲Up To Search▲

Price & Availability of BU9795AFV

	To Download BU9795AFV Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .